If improper solders or soldering practices are used, instead of forming a mechanically and electrically strong bond, a bond may form with a variety of contaminates, undesirable intermetallic compounds, and other defects. This concept is essential for critical use cases like coaxial cable assemblies for Hi-Rel applications, and is part of creating MIL-DTL-17 assemblies. ![]() These standards attempt to ensure that the end results of a soldering operation produce a reliable connection that can be inspected and ensured to meet minimum standards of performance. Initially, the United States military used MIL-STD-454, MIL-S-45743, DOD-STD-2000, and MIL-STD-2000 to define soldering practices before merging with industry standards, such as IPC J-STD-001 and IPC J-STD-006. Standardization and quality control surrounding solder and soldering practices for military electronics has been around for decades.
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